? semiconductor components industries, llc, 2005 november, 2005 ? rev. 3 1 publication order number: mmbfj177lt1/d mmbfj177lt1 jfet chopper p?channel ? depletion features ? pb?free package is available maximum ratings rating symbol value unit drain?gate voltage v dg 25 vdc reverse gate?source voltage v gs(r) ?25 vdc maximum ratings are those values beyond which device damage can occur. maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. if these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. thermal characteristics total device dissipation fr? 5 board (note 1) t a = 25 c derate above 25 c p d 225 1.8 mw mw/ c thermal resistance, junction?to?ambient r ja 556 c/w junction and storage temperature t j , t stg ?55 to +150 c 1. fr?5 = 1.0 0.75 0.062 in. http://onsemi.com marking diagram sot?23 (to?236ab) case 318?08 style 10 2 source 3 gate 1 drain 1 2 3 device package shipping ? ordering information mmbfj177lt1 sot?23 3000 tape & ree l MMBFJ177LT1G sot?23 (pb?free) 3000 tape & ree l ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our t ape and reel packaging specification s brochure, brd8011/d. 1 6y m 6y = specific device code m = date code = pb?free package (note: microdot may be in either location)
mmbfj177lt1 http://onsemi.com 2 electrical characteristics (t a = 25 c unless otherwise noted) characteristic symbol min max unit off characteristics gate?source breakdown voltage (v ds = 0, i d = 1.0 adc) v (br)gss 30 ? vdc gate reverse current (v ds = 0 vdc, v gs = 20 vdc) i gss ? 1.0 nadc gate source cutoff voltage (v ds = 15 vdc, i d = 10 nadc) v gs(off) 0.8 2.5 vdc on characteristics zero?gate?voltage drain current (v gs = 0, v ds = 15 vdc) (note 2) i dss 1.5 20 madc drain cutoff current (v ds = 15 vdc, v gs = 10 vdc) i d(off) ? 1.0 nadc drain source on resistance (i d = 500 adc) r ds(on) ? 300 input capacitance v ds = 0, v gs = 10 vdc f = 1.0 mhz c iss ? 11 pf reverse transfer capacitance c rss ? 5.5 2. pulse test: pulse width < 300 s, duty cycle 2%.
mmbfj177lt1 http://onsemi.com 3 package dimensions sot?23 (to?236ab) case 318?08 issue an *for additional information on our pb?free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* mm inches scale 10:1 0.8 0.031 0.9 0.035 0.95 0.037 0.95 0.037 2.0 0.079 style 10: pin 1. drain 2. source 3. gate d a1 3 12 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. maximum lead thickness includes lead finish thickness. minimum lead thickness is the minimum thickness of base material. 4. 318?01 thru ?07 and ?09 obsolete, new standard 318?08. view c l 0.25 l1 e e e b a see view c dim a min nom max min millimeters 0.89 1.00 1.11 0.035 inches a1 0.01 0.06 0.10 0.001 b 0.37 0.44 0.50 0.015 c 0.09 0.13 0.18 0.003 d 2.80 2.90 3.04 0.110 e 1.20 1.30 1.40 0.047 e 1.78 1.90 2.04 0.070 l 0.10 0.20 0.30 0.004 0.040 0.044 0.002 0.004 0.018 0.020 0.005 0.007 0.114 0.120 0.051 0.055 0.075 0.081 0.008 0.012 nom max l1 h 2.10 2.40 2.64 0.083 0.094 0.104 h e 0.35 0.54 0.69 0.014 0.021 0.029 c on semiconductor and are registered trademarks of semiconductor components industries, llc (scillc). scillc reserves the right to mak e changes without further notice to any products herein. scillc makes no warranty, r epresentation or guarantee regarding the suitability of its products for an y particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including wi thout limitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/or specifications can and do vary in different application s and actual performance may vary over time. all operating parameters, including ?typicals? must be validated for each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the rights of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the scillc product could create a sit uation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indemnify and hold scillc and its of ficers, employees, subsidiaries, af filiates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. publication ordering information n. american technical support : 800?282?9855 toll free usa/canada japan : on semiconductor, japan customer focus center 2?9?1 kamimeguro, meguro?ku, tokyo, japan 153?0051 phone : 81?3?5773?3850 mmbfj177lt1/d literature fulfillment : literature distribution center for on semiconductor p.o. box 61312, phoenix, arizona 85082?1312 usa phone : 480?829?7710 or 800?344?3860 toll free usa/canada fax : 480?829?7709 or 800?344?3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : http://onsemi.com order literature : http://www.onsemi.com/litorder for additional information, please contact your local sales representative.
|
